JPS6167702A - 導電性粉末及びこれを用いた導電性組成物 - Google Patents

導電性粉末及びこれを用いた導電性組成物

Info

Publication number
JPS6167702A
JPS6167702A JP59186595A JP18659584A JPS6167702A JP S6167702 A JPS6167702 A JP S6167702A JP 59186595 A JP59186595 A JP 59186595A JP 18659584 A JP18659584 A JP 18659584A JP S6167702 A JPS6167702 A JP S6167702A
Authority
JP
Japan
Prior art keywords
powder
copper particles
electrically conductive
coating material
silver coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59186595A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0421721B2 (en]
Inventor
Masayuki Tsunaga
津永　正行
Kazuaki Yuba
弓庭　和明
Yoichi Kaneko
洋一 金子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Mining and Smelting Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Priority to JP59186595A priority Critical patent/JPS6167702A/ja
Publication of JPS6167702A publication Critical patent/JPS6167702A/ja
Priority to US06/913,030 priority patent/US4888135A/en
Publication of JPH0421721B2 publication Critical patent/JPH0421721B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y10T428/2998—Coated including synthetic resin or polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Powder Metallurgy (AREA)
  • Paints Or Removers (AREA)
JP59186595A 1984-09-07 1984-09-07 導電性粉末及びこれを用いた導電性組成物 Granted JPS6167702A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP59186595A JPS6167702A (ja) 1984-09-07 1984-09-07 導電性粉末及びこれを用いた導電性組成物
US06/913,030 US4888135A (en) 1984-09-07 1986-09-29 Electrically conductive powder and electrically conductive composition using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59186595A JPS6167702A (ja) 1984-09-07 1984-09-07 導電性粉末及びこれを用いた導電性組成物

Publications (2)

Publication Number Publication Date
JPS6167702A true JPS6167702A (ja) 1986-04-07
JPH0421721B2 JPH0421721B2 (en]) 1992-04-13

Family

ID=16191298

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59186595A Granted JPS6167702A (ja) 1984-09-07 1984-09-07 導電性粉末及びこれを用いた導電性組成物

Country Status (2)

Country Link
US (1) US4888135A (en])
JP (1) JPS6167702A (en])

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012133627A1 (ja) * 2011-03-31 2012-10-04 戸田工業株式会社 銀コート銅粉及びその製造法、該銀コート銅粉を含有する導電性ペースト、導電性接着剤、導電性膜、及び電気回路
WO2012164925A1 (ja) * 2011-05-31 2012-12-06 東洋インキＳｃホールディングス株式会社 導電性シート及びその製造方法、並びに電子部品
JP2015021143A (ja) * 2013-07-16 2015-02-02 Ｄｏｗａエレクトロニクス株式会社 銀被覆銅合金粉末およびその製造方法
JP2015021145A (ja) * 2013-07-16 2015-02-02 Ｄｏｗａエレクトロニクス株式会社 銀被覆銅合金粉末およびその製造方法
WO2015194347A1 (ja) * 2014-06-16 2015-12-23 三井金属鉱業株式会社 銅粉、その製造方法、及びそれを含む導電性組成物
TWI550650B (zh) * 2012-07-18 2016-09-21 東洋油墨Ｓｃ控股股份有限公司 導電性片以及電子零件

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1337545C (en) * 1988-02-01 1995-11-14 Yoshinobu Nakamura Copper powder for electroconductive paints and electroconductive paint compositions
US5378533A (en) * 1989-07-17 1995-01-03 Fujii Kinzoku Kako Co., Ltd. Electrically conductive exothermic composition comprising non-magnetic hollow particles and heating unit made thereof
US5853622A (en) * 1990-02-09 1998-12-29 Ormet Corporation Transient liquid phase sintering conductive adhesives
US5376403A (en) * 1990-02-09 1994-12-27 Capote; Miguel A. Electrically conductive compositions and methods for the preparation and use thereof
JP2660937B2 (ja) * 1990-07-16 1997-10-08 三井金属鉱業株式会社 銅導電性組成物
US5288769A (en) * 1991-03-27 1994-02-22 Motorola, Inc. Thermally conducting adhesive containing aluminum nitride
US5281684A (en) * 1992-04-30 1994-01-25 Motorola, Inc. Solder bumping of integrated circuit die
US5736070A (en) * 1992-10-13 1998-04-07 Tatsuta Electric Wire And Cable Co., Ltd. Electroconductive coating composition, a printed circuit board fabricated by using it and a flexible printed circuit assembly with electromagnetic shield
JPH07211132A (ja) * 1994-01-10 1995-08-11 Murata Mfg Co Ltd 導電性ペーストおよびこれを用いた積層セラミックコンデンサの製造方法
DE19511012A1 (de) * 1994-04-06 1995-10-12 Merck Patent Gmbh Oberflächenmodifiziertes, leitfähiges Pigment
US5958590A (en) * 1995-03-31 1999-09-28 International Business Machines Corporation Dendritic powder materials for high conductivity paste applications
US5837119A (en) * 1995-03-31 1998-11-17 International Business Machines Corporation Methods of fabricating dendritic powder materials for high conductivity paste applications
US6080336A (en) * 1998-06-19 2000-06-27 Kyoto Elex Co., Ltd. Via-filling conductive paste composition
US6013203A (en) * 1998-08-19 2000-01-11 Enthone-Omi, Inc. Coatings for EMI/RFI shielding
DE10000834A1 (de) * 2000-01-12 2001-08-16 Fraunhofer Ges Forschung Verfahren zur Herstellung elektrisch leitender Verbindungen
US7799408B2 (en) * 2001-01-24 2010-09-21 Kaken Tech Co. Ltd. Conductive powder, conductive composition, and producing method of the same
US7195721B2 (en) * 2003-08-18 2007-03-27 Gurin Michael H Quantum lilypads and amplifiers and methods of use
JP4134134B2 (ja) * 2004-12-30 2008-08-13 パナゼム カンパニー リミテッド 導電性ペイント組成物およびこれを適用した電磁波遮蔽用導電膜
KR100739061B1 (ko) * 2005-07-29 2007-07-12 삼성에스디아이 주식회사 전극 형성용 감광성 조성물, 전사필름, 전극 및 이를포함하는 플라즈마 디스플레이 패널
ATE397647T1 (de) * 2006-03-06 2008-06-15 Umicore Ag & Co Kg Zusammensetzung zur befestigung von hochleistungshalbleiter
CN101919005A (zh) 2007-09-13 2010-12-15 汉高股份两合公司 导电组合物
US8926869B2 (en) * 2007-10-28 2015-01-06 Clover Technologies Group, Llc Method and composition for recoating toner cartridge developing member
EP2230561A1 (en) * 2009-03-20 2010-09-22 Wazana Brothers International, Inc., d/b/a Micro Solutions Enterprises Method and composition for recoating toner cartridge developing member
TWI383950B (zh) * 2009-04-22 2013-02-01 Ind Tech Res Inst 奈米點狀材料的形成方法
US20130048921A1 (en) * 2011-07-21 2013-02-28 Hitachi Chemical Co., Ltd. Conductive material
JP6866408B2 (ja) * 2019-01-11 2021-04-28 Ｊｘ金属株式会社 表面処理された金属粉及び導電性組成物
CN113302245A (zh) 2019-01-18 2021-08-24 汉高知识产权控股有限责任公司 可拉伸导电油墨组合物
CN115505299B (zh) * 2022-11-17 2023-03-28 长春黄金研究院有限公司 用于陶瓷基底的耐磨银涂料及其制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53135495A (en) * 1977-04-28 1978-11-27 Fujikura Kasei Kk Method of manufacturing electroconductive composition
JPS5554502A (en) * 1978-10-16 1980-04-21 Nippon Mining Co Ltd Production of noble metal plated composite powder
JPS568892A (en) * 1979-07-05 1981-01-29 Fujikura Ltd Printed circuit board conductive paste and printed circuit board using same
US4305847A (en) * 1979-07-26 1981-12-15 Acheson Industries, Inc. Copper coating composition for shielding electronic equipment and the like
JPS5734606A (en) * 1980-08-08 1982-02-25 Mitsui Toatsu Chemicals Conductive composition
JPS5796401A (en) * 1980-12-09 1982-06-15 Toyama Prefecture Conductive paint using lacquer group resin
US4521329A (en) * 1983-06-20 1985-06-04 E. I. Du Pont De Nemours And Company Copper conductor compositions
DE3466118D1 (en) * 1983-11-30 1987-10-15 Nissan Chemical Ind Ltd Electrically conductive composition
DE3564636D1 (en) * 1984-07-31 1988-09-29 Mitsubishi Petrochemical Co Copper-type conductive coating composition
DE3602373A1 (de) * 1985-01-31 1986-08-07 Mitsubishi Petrochemical Co., Ltd., Tokio/Tokyo Metallpulverhaltige polymerisatzusammensetzung
US4716081A (en) * 1985-07-19 1987-12-29 Ercon, Inc. Conductive compositions and conductive powders for use therein
US4687597A (en) * 1986-01-29 1987-08-18 E. I. Du Pont De Nemours And Company Copper conductor compositions

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012133627A1 (ja) * 2011-03-31 2012-10-04 戸田工業株式会社 銀コート銅粉及びその製造法、該銀コート銅粉を含有する導電性ペースト、導電性接着剤、導電性膜、及び電気回路
WO2012164925A1 (ja) * 2011-05-31 2012-12-06 東洋インキＳｃホールディングス株式会社 導電性シート及びその製造方法、並びに電子部品
CN103597551A (zh) * 2011-05-31 2014-02-19 东洋油墨Sc控股株式会社 导电性片及其制造方法以及电子零件
JPWO2012164925A1 (ja) * 2011-05-31 2015-02-23 東洋インキＳｃホールディングス株式会社 導電性シート及びその製造方法、並びに電子部品
CN103597551B (zh) * 2011-05-31 2016-04-06 东洋油墨Sc控股株式会社 导电性片及其制造方法以及电子零件
TWI550650B (zh) * 2012-07-18 2016-09-21 東洋油墨Ｓｃ控股股份有限公司 導電性片以及電子零件
JP2015021143A (ja) * 2013-07-16 2015-02-02 Ｄｏｗａエレクトロニクス株式会社 銀被覆銅合金粉末およびその製造方法
JP2015021145A (ja) * 2013-07-16 2015-02-02 Ｄｏｗａエレクトロニクス株式会社 銀被覆銅合金粉末およびその製造方法
WO2015194347A1 (ja) * 2014-06-16 2015-12-23 三井金属鉱業株式会社 銅粉、その製造方法、及びそれを含む導電性組成物
KR20170008744A (ko) * 2014-06-16 2017-01-24 미쓰이금속광업주식회사 구리분, 그 제조 방법, 및 그것을 포함하는 도전성 조성물
JPWO2015194347A1 (ja) * 2014-06-16 2017-04-20 三井金属鉱業株式会社 銅粉、その製造方法、及びそれを含む導電性組成物

Also Published As

Publication number Publication date
US4888135A (en) 1989-12-19
JPH0421721B2 (en]) 1992-04-13

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